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By D. A. Beck (auth.), Gerald A. Walker (eds.)

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Additional info for Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

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The container shall be removed following cure. 4) Subject the embedded specimen three times to the follOwing cycle! 4 hr at room temperature (75±HfF) immediately followed by 4 hr at -65"F, then immediately return to room temperature. Visually inspect for cracks following each cycle. ) In addition to Eccospheres-R: Emerson and Cuming also produces refined grades of microballoons with improved chemical, temperature, and moisture resistance. " The greater range of particle distribution for Eccospheres-R, although admittedly quite variable, results in castings that are superior in cold-shock resistance to those containing refined microballoons.

Figure 3 illustrates that its modulus of elasticity is much more suitable than that of either aluminum or magnesium. Figure 19 shows the sheet buckling resistance comparison at elevated temperatures of various materials and one can readily see the reduced weight possibilities by using beryllium. However, if that dollar sign blurs your vision too much, take a look at the magnesium-thorium alloys - both HK31 and HM21. These two materials maintain usable tensile properties up in the 600 to 800°F range whereas 6061 and 7075 aluminum and magnesium AZ31 lose their strength rapidly after 300 to 400°.

I do not know of any tests on magnesium with Fluoride Anodize, but think it would be quite low since the coating appears to be only a few molecules thick. HAE coating had practically no effect on attenuation with some samples, + 10 to 15'% with others. 19 Materials for Electronic Packaging Incidentally, the cavity plates in Fig. 18 with their highly "compacted" pattern and consequent saving in volume and weight were made practical by the use of a Bendix numerically controlled milling machine. The numerical control equipment for this machine was developed by the Bendix Research Laboratories and produced by the Bendix Industrial Controls Section.

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